Temperature controller for manufacturing semiconductor

A temperature controller for semiconductor fabrication, comprising:

• a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber;
• and
• an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber, wherein the upper chiller includes a storage tank configured to store a cooling fluid, a pump connected with the storage tank and configured to pump the cooling fluid, a heat exchanger connected with the pump and configured to exchange heat from the cooling fluid, a three-way valve connected with the heat exchanger and configured to supply a portion of the cooling fluid to the upper chamber through a supplying pipe and bypass another portion of the cooling fluid to the storage tank through a bypass pipe, an upper chamber temperature sensor configured to sense the temperature of the upper chamber, a first proportional integral derivative (PID) controller configured to determine an amount of heat exchanged in the heat exchanger based on the temperature sensed by the upper chamber temperature sensor, and a second PID controller configured to determine a degree of bypass opening of the three-way valve based on the temperature sensed by the upper chamber temperature sensor.