Microfabrication techniques and devices for thermal management of electronic devices

1) A method of fabricating a thermal management device, comprising:

• depositing a seed layer, using a seed layer depositing technique, on a side of a support base;
• growing a heat sink base layer on a side of the seed layer opposite the support base, using a heat sink base layer growth technique;
• depositing a hard mask on a side of the support base directly opposite that containing the seed and heat sink base layers, using one or more hard mask depositing techniques;
• patterning the hard mask with a photoresist mask and one or more patterning techniques;
• etching the patterned hard mask with an etching technique, wherein the etching creates trenches in the underlying support base, exposing the seed layer;
• removing the hard mask with a hard mask removal technique;
• depositing a layer of photoresist on the heat sink base layer on a side of the heat sink base layer opposite the seed layer;
• growing heat sinks using a heat sink growth technique on the exposed seed layer opposite the heat sink base layer;
• removing the photoresist layer with a photoresist layer removal technique;
• and
• removing the support base with a support base removal technique.