Chemical liquid application apparatus and manufacturing method of semiconductor device
AssigneeToshiba Memory Corporation
InventorYoshiharu ONO
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AssigneeToshiba Memory Corporation
InventorYoshiharu ONO
Estimating the term…
A chemical liquid application apparatus of an embodiment is a chemical liquid application apparatus that applies a chemical liquid to a substrate and removes the chemical liquid on an edge of the substrate by a predetermined width in a state where the substrate is being rotated by a spinner. The chemical liquid application apparatus includes a detection unit that detects a position of a mark on the substrate, a transfer unit that transfers the substrate onto the spinner, and a control unit that calculates a center position of a shot map from the position of the mark and controls the transfer unit to cause the center position of the shot map to coincide with a rotating center of the spinner when the transfer unit transfers the substrate onto the spinner.
A chemical liquid application apparatus that applies a chemical liquid to a substrate and removes the chemical liquid on an edge of the substrate by a predetermined width in a state where the substrate is being rotated by a spinner, the chemical liquid application apparatus comprising:
A manufacturing method of a semiconductor device performed by a chemical liquid application apparatus that applies a chemical liquid to a substrate and removes the chemical liquid on an edge of the substrate by a predetermined width in a state where the substrate is being rotated by a spinner, the manufacturing method comprising:
Dependencies are inferred from the claim text.