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US 2019/0244807 A1Published application
Blocking Structures on Isolation Structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Hsuan Yang, Wen Han Hung, Tzy-Kuang Lee, Chia Ying Lin
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Abstract
A semiconductor device includes a semiconductor substrate, a plurality of isolation structures on the semiconductor substrate, and a plurality of blocking structures disposed directly over the isolation structures. The blocking structures have a lower reflectivity than the isolation structures.
Claims20
A semiconductor device comprising:
- a semiconductor substrate;
- a plurality of isolation structures on the semiconductor substrate;
- a plurality of blocking structures disposed directly over the isolation structures, the blocking structures having a lower reflectivity than the isolation structures.
A semiconductor device comprising:
- a first isolation structure formed into a semiconductor substrate so that the isolation structure circumscribes a portion of the semiconductor substrate;
- a second isolation structure formed within the portion of the semiconductor substrate so that the second isolation structure circumscribes a sub-portion of the semiconductor substrate;
- and
- a blocking structure disposed over the first isolation structure, the blocking structure having a lower reflectivity than the first isolation structure.
1 more element
A semiconductor device comprising:
- a semiconductor substrate;
- an isolation structure that is sized and shaped to isolate a two-dimensional array of separated portions of the semiconductor substrate;
- a plurality of blocking structures positioned over the isolation structure such that each of the separated portions of the semiconductor substrate are surrounded by the blocking structures, the blocking structures having a lower reflectivity than the isolation structure;
- and
- semiconductor devices formed within the separated portions.
2 more elements
Dependencies are inferred from the claim text.