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US 2019/0244804 A1Published application
Post-CMP Cleaning and Apparatus
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFu-Ming Huang, Liang-Guang Chen, Ting-Kui Chang, Chun-Chieh Lin
Life of this patent
Estimating the term…
Abstract
A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.
Claims20
An apparatus for performing a cleaning on a wafer, the apparatus comprising:
- a chuck configured to hold and rotate the wafer;
- a first brush having a first axis parallel to a surface of the wafer;
- a first driving mechanism for rotating the first brush;
- a second brush having a second axis parallel to the surface of the wafer;
- and
- a second driving mechanism for rotating the second brush, wherein the first brush and the second brush rotate around the same axis.
3 more elements
An apparatus comprising:
- a wafer holding chuck;
- a first brush over the wafer holding chuck;
- a second brush over the wafer holding chuck;
- a first driving component attached to the first brush, and a gliding guide;
- and
- a second driving component attached to the second brush and the gliding guide.
3 more elements
An apparatus comprising:
- a chuck having an opening for holding a wafer, the chuck being configured to rotate the wafer around a first axis;
- a first brush over the chuck, the first brush having a first longitudinal axis perpendicular to the first axis, wherein a first length of the first brush along the first longitudinal axis is equal to or less than half a diameter of the opening;
- and
- a second brush over the chuck, the second brush having a second longitudinal axis perpendicular to the first axis, wherein a second length of the second brush along the second longitudinal axis is equal to or less than half the diameter of the opening.
1 more element
Dependencies are inferred from the claim text.