Plasma processing apparatus

A plasma processing apparatus that performs a processing by applying plasma of a processing gas on a substrate to be processed, the apparatus comprising:

• a processing container configured to accommodate the substrate to be loadable/unloadable;
• a lower electrode disposed in the processing container so as to mount the substrate thereon;
• an upper electrode disposed in the processing container to face the lower electrode with a processing space being interposed therebetween;
• a high frequency power source configured to apply a high frequency power between the upper electrode and the lower electrode;
• a main magnet unit provided on a top surface of the upper electrode and including one or more annular main electromagnetic coils arranged around a common central axis passing through a center of the upper electrode and a center of the lower electrode in a vertical direction from an upper side of the main magnet unit, and a main yoke configured to cover the one or more annular main electromagnetic coils, the main magnet unit being configured to form a magnetic field that passes through the processing space while drawing U-shaped loops point-symmetrically about the common central axis in a vertical plane;
• and
• an auxiliary magnet unit provided radially outside of any one of the annular main electromagnetic coils on the top surface of the upper electrode and including an auxiliary yoke formed by a core portion of the main yoke that has a predetermined radius from the common central axis and a plurality of bar-shaped electromagnets vertically protruding from a lower surface of the auxiliary yoke, wherein the bar-shaped electromagnets are offset from the common central axis by a given distance and arranged at regular intervals in a circumferential direction, the auxiliary magnetic unit being configured to form a magnetic field that perpendicularly or obliquely crosses the common central axis in the processing space.