Electronic component and manufacturing method for the same

A manufacturing method for an electronic component comprising:

• preparing an element body including a top surface, a bottom surface opposing the top surface, and a plurality of side surfaces connecting the top surface and the bottom surface;
• providing a lower layer electrode of at least one of the plurality of outer electrodes on at least one of the top surface and the bottom surface;
• and
• providing an upper layer electrode of the outer electrode such that the upper layer electrode overlies the lower layer electrode and extends from an upper side of the lower layer electrode onto the side surface of the element body;
• wherein
• when viewed from a direction orthogonal or substantially orthogonal to the top surface and the bottom surface, an edge of the lower layer electrode is disposed at a position farther from the side surface at which the upper layer electrode is to be provided than a position of an edge of the upper layer electrode;
• and
• a radius of curvature of the edge of the lower layer electrode is larger than a radius of curvature of the edge of the upper layer electrode.