Heat dissipation structure for magnetic component and magnetic component having the same

Abstract

The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.

Dependencies are inferred from the claim text.