Thickness measurement of substrate using color metrology
AssigneeApplied Materials, Inc.
InventorsDominic J. Benvegnu, Boguslaw A. Swedek
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AssigneeApplied Materials, Inc.
InventorsDominic J. Benvegnu, Boguslaw A. Swedek
Estimating the term…
A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles of incidence, and a controller. The controller is configured to store a function that provides a value representative of a thickness as a function of position along a predetermined path in a coordinate space of at least four dimensions. For a pixel in the two color images, the controller determines a coordinate in the coordinate space from the color data, determines a position of a point on the predetermined path that is closest to the coordinate, and calculates a value representative of a thickness from the function and the position of the point on the predetermined path.
A system for obtaining a measurement representative of a thickness of a layer on a substrate, comprising:
A computer program product for obtaining a measurement representative of a thickness of a layer on a substrate, the computer program product tangibly embodied in a non-transitory computer readable medium, comprising instructions for causing a processor to:
A method of obtaining a measurement representative of a thickness of a layer on a substrate, comprising:
A polishing system, comprising:
Dependencies are inferred from the claim text.