Fingerprint Sensor Device and Method

A method of manufacturing a fingerprint sensor, the method comprising:

• placing a connection block next to a sensor, the connection block comprising a via that extends a portion of a way through the connection block;
• connecting the via to the sensor through a first redistribution layer;
• thinning a surface of the connection block to expose the via and form a thinned surface, the surface of the connection block being on an opposite side of the connection block from the first redistribution layer;
• forming a second redistribution layer adjacent to the thinned surface of the connection block;
• and
• connecting a high voltage chip to the sensor through the second redistribution layer, the via, and the first redistribution layer.

A fingerprint sensor comprising:

• a sensor;
• a first redistribution layer adjacent a first side of the sensor;
• a second redistribution layer adjacent a second side of the sensor opposite the first side of the sensor;
• a high voltage chip connected to the first redistribution layer;
• a via connecting the first redistribution layer and the second redistribution layer, wherein the via extends through a connection block;
• and
• an encapsulant separating the connection block from the sensor.