Resin composition
AssigneeToray Industries, Inc.
InventorsYusuke KOMORI, Kazuto MIYOSHI
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AssigneeToray Industries, Inc.
InventorsYusuke KOMORI, Kazuto MIYOSHI
Estimating the term…
The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO)n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO)n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.
A resin composition comprising:
An amido-phenol based dissolution accelerator as represented by any one of general formulae (3) to (5) given below:
An aromatic amido acid based dissolution accelerator as represented by any one of general formulae (6) to (10) given below:
A cured film comprising an alkali-soluble resin (a), a benzoxazole compound as represented by any one of general formulae (11) to (13) given below, and/or an imide compound as represented by any one of general formulae (14) to (16) given below:
Dependencies are inferred from the claim text.