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US 2019/0241692 A1Published application
Photosensitive resin and manufacturing method thereof
AssigneePacific Light & Hologram, Inc.
InventorsTina Qin, Joshua D. Wiensch
Life of this patent
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Abstract
Various embodiments disclosed relate to photopolymerizable compositions that are suitable for making three-dimensional structures when exposed to laser light.
Claims20
A composition comprising:
- at least one monomer or oligomer comprising urethane acrylate;
- at least one monomer comprising pentaerythritol acrylate;
- at least one polyester acrylate resin;
- and
- at least one photo initiator.
2 more elements
A composition comprising:
- about 40 wt % of a monomer comprising aliphatic urethane diacrylate;
- about 40 wt % of monomer comprising ethoxylated pentaerythritol tetraacrylate;
- about 20 wt % of a thiol substituted polyester acrylate resin;
- and
- at least one photo initiator having the structure
2 more elements
A method of making a polymerizable composition, comprising:
- combining at least one monomer comprising urethane acrylate, at least one monomer comprising pentaerythritol acrylate, and at least one polyester acrylate resin to form a homogenous mixture;
- combining the homogenous mixture with a photo initiator to form an initial mixture;
- and
- stirring the initial mixture at a temperature greater than about 30° C.
1 more element
The method of claim 21, herein initial mixture is stirred at about 40° C.
Dependencies are inferred from the claim text.