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AssigneeEpack, Inc.
InventorsJay MITCHELL, David LEMMERHIRT, Onnop SRIVANNAVIT
Estimating the term…
A space-efficient, planar interposer for packaging and support of a device (e.g., MEMS device) is provided. The interposer has a device-mounting region for supporting a device, such as a sensor, accelerometer, gyroscope, etc. The interposer is formed from a single layer of material, and has cut-outs or gaps formed therein to define springs. The springs connect the device-mounting region to anchor regions configured to anchor the interposer to an underlying substrate or package. The cut-outs or gaps of the interposer are made with space-efficiency in mind. In certain embodiments, the cut-outs or gaps extend inwardly toward the center of the interposer such that the anchor regions can also extend inwardly, and at least a portion of each anchor region is further inboard on the interposer than a portion of the device-mounting region. As such, the anchor regions can be located within an extended or virtual perimeter of the device-mounting region.
A planar interposer formed from a single planar layer of material, the planar interposer configured to isolate a device from mechanical stress, vibration or thermal variation, the planar interposer comprising:
An interposer for isolating a MEMS device from its package, the interposer comprising:
Dependencies are inferred from the claim text.