US 2019/0174639 A1 · RESIN MULTILAYER SUBSTRATE · patentgrep

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Abstract

A resin multilayer substrate includes a stacked body including resin layers, a component, one or more first conductor patterns, and one or more second conductor patterns each disposed in a gap between the resin layers. At least a portion of an outline of each of the one or more first conductor patterns overlaps with the component. An outline of each of the one or more second conductor patterns does not overlap with the component. A resin portion is adjacent to each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the component. The resin portion is made of a resin paste including thermoplastic resin powder as a main material. The resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

Claims18

Dependent claims

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a component embedded in the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body, the one or more first conductor patterns each including an outline in a view seen in one direction of a stacking direction of the stacked body;
and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body, the one or more second conductor patterns each including an outline in the view seen in the one direction of the stacking direction of the stacked body;
wherein
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the component in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the component in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns overlapping with the component;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

10 more elements

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a cavity provided in the stacked body so as to be recessed in a stacking direction of the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in a view seen in one direction of the stacking direction of the stacked body;
and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in the view seen in the one direction of the stacking direction of the stacked body;
wherein
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the cavity;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

10 more elements

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a first conductive foil embedded in the stacked body;
one or more first conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in a view seen in one direction of a stacking direction of the stacked body;
and
one or more second conductor patterns each disposed in a gap between the plurality of resin layers inside the stacked body and each including an outline in the view seen in the one direction of the stacking direction of the stacked body;
wherein
the first conductive foil is thicker than each of the one or more first conductor patterns and each of the one or more second conductor patterns;
at least a portion of the outline of each of the one or more first conductor patterns overlaps with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more second conductor patterns does not overlap with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the first conductive foil;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.

11 more elements

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a component embedded in the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in a stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body;
and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the second conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body;
wherein
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the component in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the component in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a portion of the outline of each of the one or more conductor-via first joint portions that overlaps with the component;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

10 more elements

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a cavity provided in the stacked body so as to be recessed in a stacking direction of the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body;
and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the second conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body;
wherein
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the cavity in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a part of the outline of each of the one or more conductor-via first joint portions that overlaps with the cavity;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

10 more elements

A resin multilayer substrate comprising:

a stacked body including a plurality of resin layers each made of a thermoplastic resin as a main material and stacked on each other;
a first conductive foil embedded in the stacked body;
one or more conductor-via first joint portions each corresponding to a first joining portion between first conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in a stacking direction of the stacked body, the one or more conductor-via first joint portions each including an outline of a first joining surface in a view seen in one direction of the stacking direction of the stacked body;
and
one or more conductor-via second joint portions each corresponding to a second joining portion between second conductor vias each penetrating through one of the plurality of resin layers inside the stacked body such that the first conductor vias are continuous to each other in the stacking direction of the stacked body, the one or more conductor-via second joint portions each including an outline of a second joining surface in the view seen in the one direction of the stacking direction of the stacked body;
wherein
the first conductive foil is thicker than each of other conductive foils disposed inside the stacked body;
at least a portion of the outline of each of the one or more conductor-via first joint portions overlaps with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
the outline of each of the one or more conductor-via second joint portions does not overlap with the first conductive foil in the view seen in the one direction of the stacking direction of the stacked body;
a resin portion is provided adjacent to an outside of each of the one or more conductor-via first joint portions along a portion of the outline of each of the one or more conductor-via first joint portions that overlaps with the first conductive foil;
the resin portion is made of a resin paste including thermoplastic resin powder as a main material;
a liquid component of the resin paste is not substantially present in the resin portion;
and
the resin portion is not disposed in a portion along the outline of each of the one or more conductor-via second joint portions.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/270,659Filed 8 Feb 2019
Priority: JP 2016-16263223 Aug 2016
Published: 6 Jun 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H05K 3/4644
Manufacturing multilayer circuits: by building the multilayer layer by layer, i.e. build-up multilayer circuits
H05K 1/032
Organic insulating material: consisting of one material
H05K 1/115
Printed elements for providing electric connections to or between printed circuits: via connections; Lands around holes or via connections
H05K 1/186
Associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of…:…

Family

Application16/270,659Continuation
US 10,660,219 B2Related patent
US 2019/0174639 A1This patent

From the US filing history. Foreign family members aren’t listed.

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