Back to results
US 2019/0174638 A1Published application
Cooling Component Carrier Material by Carbon Structure Within Dielectric Shell
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsJonathan Silvano de Sousa, Markus Leitgeb, Walter Pessl
Life of this patent
Estimating the term…
Abstract
A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.
Claims24
A component carrier, comprising:
- component carrier material;
- and
- a heat spreading module which comprises a dielectric shell and a carbon structure enclosed within the dielectric shell for disabling contact between the carbon structure and the component carrier material.
-14. (canceled)
-20. (canceled)
-28. (canceled)
A component carrier, comprising:
- a carbon structure;
- a dielectric shell hermetically enclosing the carbon structure;
- and
- a patterned electric conductor structure on the dielectric shell.
1 more element
A method, comprising:
- providing a heat spreading module which comprises a carbon structure enclosed by a dielectric shell;
- and
- integrating the heat spreading module in component carrier material.
-37. (canceled)
Dependencies are inferred from the claim text.