Material temperature sensor for stencil printer

A method of printing an assembly material on an electronic substrate, the method comprising:

• delivering an electronic substrate to a stencil printer;
• positioning the electronic substrate in a print position;
• engaging a stencil having apertures to the electronic substrate;
• performing a print stroke with a wiper blade to force solder paste through the apertures of the stencil on to the electronic substrate;
• depositing solder paste between wiper blades during the print stroke;
• and
• measuring a temperature of the assembly material contained within a cartridge.

A print head assembly of a stencil printer, the print head assembly comprising:

• a print head frame;
• a wiper blade assembly coupled to the print head frame, the wiper blade assembly having wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke, the wiper blades being configured to force solder paste through the apertures of the stencil;
• a dispensing unit coupled to the print head frame, the dispensing unit being configured to deposit solder paste between the wiper blades, the dispensing unit including a cartridge receiver;
• a cartridge positioned in the cartridge receiver;
• and
• a sensor coupled to the print head frame proximate the cartridge, the sensor being configured to measure a temperature of the cartridge.

A stencil printer for printing an assembly material on an electronic substrate, the stencil printer comprising:

• a frame;
• a stencil coupled to the frame, the stencil having apertures formed therein;
• a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate in a print position beneath the stencil;
• and
• a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes, the print head assembly including
• a print head frame,
• a wiper blade assembly coupled to the print head frame, the wiper blade assembly having wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke, the wiper blades being configured to force solder paste through the apertures of the stencil,
• a dispensing unit coupled to the print head frame, the dispensing unit being configured to deposit solder paste between the wiper blades, the dispensing unit including a cartridge receiver, and
• a sensor coupled to the print head frame, the sensor being configured to measure a temperature of the solder paste deposited by the dispensing unit.