Miniaturized circuit and method of making the same

A method for making a miniaturized circuit, comprising the steps of:

• depositing a bottom metal layer on a surface of a substrate, the bottom metal layer including a first metal;
• forming a patterned photoresist layer on the bottom metal layer such that a first portion of the bottom metal layer is exposed from the patterned photoresist layer and a second portion of the bottom metal layer is covered by the patterned photoresist layer;
• plating a middle circuit pattern on the bottom metal layer so that the first portion of the bottom metal layer is covered by the middle circuit pattern, the middle circuit pattern including a second metal;
• plating a top circuit pattern onto the middle circuit pattern so as to cover a portion of the middle circuit pattern that is not in contact with the bottom metal layer and the patterned photoresist layer, the top circuit pattern including a third metal different from the first metal;
• removing the patterned photoresist layer to expose the second portion of the bottom metal layer;
• and
• etching the second portion of the bottom metal layer with an etchant, so as to pattern the bottom metal layer into a bottom circuit pattern, the bottom circuit pattern being disposed underneath the middle circuit pattern.