Multilayer circuit board, multilayer electronic component, and module

A multilayer circuit board comprising:

• a laminate including a plurality of insulating layers;
• conductive patterns each provided at an interlayer between corresponding ones of the plurality of insulating layers;
• a via conductor extending through at least one of the plurality of insulating layers;
• and
• an external terminal provided on a lower main surface of the laminate;
• wherein
• a shield electrode layer connected to a ground potential is provided on at least one side surface of the laminate;
• at least one surrounding conductive pattern surrounding an element to be shielded is provided at an interlayer between corresponding ones of the plurality of insulating layers as one of the conductive patterns;
• and
• both ends of the surrounding conductive pattern are connected to the shield electrode layer.