Component Carrier With Different Surface Finishes and Method for Manufacturing the Same
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsGiordano Di Gregorio, Seok Kim (Annie) Tay, Karl Wang
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Abstract
A component carrier and a method for manufacturing the same are disclosed. The component carrier includes an electrically conductive layer structure and an overhanging end. A first surface finish is formed on a first surface portion of the electrically conductive layer structure. Furthermore, the component carrier further includes a second surface finish on a second surface portion of the electrically conductive layer structure connected to the first surface finish and extending under the overhanging end.
Claims20
A component carrier, comprising:
- an electrically conductive layer structure;
- a first surface finish formed on a first surface portion of the electrically conductive layer structure and having an overhanging end;
- and
- a second surface finish on a second surface portion of the electrically conductive layer structure connecting to the first surface finish and extending under the overhanging end.
A method of manufacturing a component carrier, the method comprising:
- forming a first surface finish on a first surface portion of an electrically conductive layer structure;
- forming an overhanging end of the first surface finish by removing material of the first surface finish;
- and
- forming a second surface finish on a second surface portion of the electrically conductive layer structure, wherein the second surface finish is connected to the first surface finish and extends under the overhanging end.
Dependencies are inferred from the claim text.