Release material

6-13. (canceled)

14:

• The release material according to claim 5, wherein the low friction film is selected from the group consisting of an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film.

15:

• The release material according to claim 5, wherein each of the high-density polyethylene films has a viscosity average molecular weight of from 20,000 to 500,000.

16:

• The release material according to claim 5, wherein each of the high-density polyethylene films has a melt flow index of 0.03 to 0.08.

17:

• The release material according to claim 14, wherein the low friction film is the ultrahigh-molecular-weight polyethylene film, and the ultrahigh-molecular-weight polyethylene film has a viscosity average molecular weight of not lower than 1,000,000.

18:

• The release material according to claim 14, wherein the low friction film is the polytetrafluoroethylene film, and the polytetrafluoroethylene film has an apparent melt viscosity at 380° C. of not lower than 101 poise.

19:

• A method of using the release material of claim 5 for heat treatment of a thermoplastic liquid crystal polymer film, the method comprising interposing the release material between the thermoplastic liquid crystal polymer film and a heat-processing device.

20:

• The method according to claim 19, wherein the thermoplastic liquid crystal polymer film is a cover film;
• and
• a board structural body including a board and a conductor circuit element disposed on at least one surface of the board is covered with the cover film.