Circuit boards and method to manufacture circuit boards
AssigneeZF Friedrichshafen AG
InventorsWilfried Lassmann, Jörg Kühni
Life of this patent
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Abstract
A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly.
Claims15
A printed circuit board comprising
- a conductive outer layer,
- at least one conductive inner layer,
- at least one bus bar for conducting high current, and
- at least one power semiconductor for controlling and/or activating the high current,
- wherein the at least one bus bar and the at least one power semiconductor are disposed on a side of the outer layer (2) facing away from the at least one inner layer.
The printed circuit board of 7, wherein the at least one contact section is soldered to the outer layer.
The printed circuit board of 11, wherein an EMC component is located between the at least one non-contact section of the at least one bus bar and the outer layer (2).
A method for the production of a printed circuit board, containing the following steps:
- provision of a multilayer system, comprising a conductive outer layer and at least one conductive inner layer, and
- placement of at least one bus bar and at least one power semiconductor on a side of the outer layer facing away from the at least one inner layer.
Dependencies are inferred from the claim text.