Solder reflow apparatus and method of manufacturing an electronic device

A method of manufacturing an electronic device, comprising:

• printing a solder paste on a plurality of substrate pads of a substrate;
• forming solders on input/output pads of an electronic product respectively;
• disposing the electronic product on the substrate such that the solders are interposed between the input/output pad and the solder paste;
• generating a first microwave toward the solder paste during a reflow stage to heat the solder paste;
• and
• changing a phase of the first microwave during the reflow stage,
• wherein heating of the solder paste causes the solders to reflow, thereby forming a solder bump between the corresponding substrate pad and the input/output pad.

A method of manufacturing an electronic device, comprising:

• coating a solder paste on a substrate pad of a substrate;
• disposing an electronic product on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste;
• generating a first microwave toward the solder paste during a preheat stage to pre-heat the solder paste;
• generating a second microwave toward the solder paste during a reflow stage to heat the solder paste;
• and
• changing a phase of the second microwave during the reflow stage,
• wherein heating of the solder paste during the reflow stage causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.