Re-generation and re-transmission of millimeter waves for building penetration using dongle transceivers

A system for enabling signal penetration into a building, comprising:

• first circuitry, located on an outside of the building, for receiving RF signals and converting the RF signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link, wherein the first circuitry further comprises:
• a first transceiver dongle including a signal processing chipset for converting the received RF signals to the format that overcomes the losses occurring when the signals penetrates the structure of the building;
• and
• second circuitry, located on the interior of the building, for receiving the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converting the signals to a second format for transmission to the wireless devices within the building, wherein the second circuitry further comprises:
• a second transceiver dongle including the signal processing chipset for converting the received signals in the format that overcomes the losses caused by penetrating into the interior of the building into the second format.

A system for enabling signal penetration into a building, comprising:

• first circuitry, located on an outside of the building, for receiving millimeter wave signals and converting the millimeter wave signals into a format that overcomes losses caused by penetrating a structure of the building over a wireless communications link, wherein the first circuitry further comprises:
• a first transceiver dongle including a Peraso chipset for converting the received millimeter wave signals to the format that overcomes the losses occurring when the millimeter wave signals penetrates the structure of the building;
• and
• second circuitry, located on the interior of the building, for receiving the signals in the format that overcomes the losses caused by penetrating the structure of the building over the wireless communications link and converting the signals in the format that overcomes the losses caused by penetrating the structure of the building to a second format for transmission to the wireless devices within the building, wherein the second circuitry further comprises:
• a second transceiver dongle including the Peraso chipset for converting the received millimeter signals in the format that overcomes the losses caused by penetrating the structure of the building into the second format;
• and
• a WiFi router to transmit signals to the wireless devices within the building