Amplifiers with in-package radial stub harmonic traps
AssigneeNXP USA, Inc.
InventorsRamanujam SRINIDHI EMBAR, Roy MCLAREN
Life of this patent
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Abstract
An amplifier package may include a transistor, an output impedance matching circuit and one or more radial stub harmonic traps coupled to a control terminal of the transistor or to an output terminal of the transistor. The output impedance matching circuit and the radial stub harmonic traps may be formed on a single substrate or separate substrates, which may be formed from gallium nitride. Each radial stub harmonic trap may provide a low resistance path to ground for signal energy above a fundamental operating frequency of the amplifier, such as harmonic frequencies thereof.
Claims20
An amplifier package comprising:
- a conductive housing comprising a ground-plane;
- an integrated circuit die disposed on the ground-plane, the integrated circuit die comprising a transistor having a control terminal and an output terminal;
- and
- a radial stub harmonic trap formed on a substrate that is disposed on the ground-plane, wherein the radial stub harmonic trap is coupled to the transistor.
A packaged radio frequency (RF) amplifier device comprising:
- a conductive ground-plane;
- a substrate disposed on the ground-plane;
- a transistor that is formed on the substrate and that includes a control terminal and an output terminal;
- and
- a radial stub harmonic trap that is formed on the substrate and that is electrically connected to the transistor.
An electronic device comprising:
- a ground-plane;
- a substrate disposed on the ground-plane;
- a transistor that includes a control terminal and an output terminal;
- and
- a radial stub that is formed on the substrate and that is electrically connected to the transistor.
Dependencies are inferred from the claim text.