Method for Producing Optoelectronic Semiconductor Components and Optoelectronic Modules, and Optoelectronic Semiconductor Component and Optoelectronic Module

A method for producing a plurality of optoelectronic semiconductor components and/or at least one optoelectronic module, the method comprising:

• inserting a plurality of optoelectronic semiconductor chips with a suitable orientation into a linear feeding device;
• conveying the optoelectronic semiconductor chips to an injection device having an outlet opening;
• encapsulating the optoelectronic semiconductor chips with at least one cladding layer in the injection device and pressing the encapsulated optoelectronic semiconductor chips out of the outlet opening, wherein a compound of optoelectronic semiconductor chips is formed in which the optoelectronic semiconductor chips are connected to one another by the at least one cladding layer;
• and
• separating the compound into a plurality of optoelectronic semiconductor components each component having an optoelectronic semiconductor chip which is at least partially encapsulated by the at least one cladding layer, and/or separating the compound into at least one optoelectronic module comprising a plurality of optoelectronic semiconductor chips which are at least partially encapsulated and connected to one another by the at least one cladding layer.

An optoelectronic semiconductor component comprising:

• an optoelectronic semiconductor chip;
• at least one cladding layer which envelops the optoelectronic semiconductor chip in such a way that the optoelectronic semiconductor chip is mostly covered on its surface by the cladding layer;
• and
• a carrier having an assembly region on which the optoelectronic semiconductor chip is arranged and two opposing side regions arranged transversely to the assembly region,
• wherein the optoelectronic semiconductor chip is arranged at a distance from the assembly region, and
• wherein a space between the assembly region and the optoelectronic semiconductor chip is filled by the cladding layer.

An optoelectronic module comprising:

• several optoelectronic semiconductor chips;
• at least one cladding layer which envelops the optoelectronic semiconductor chips in such a way that a surface of the optoelectronic semiconductor chips is mostly covered by the cladding layer, wherein the optoelectronic semiconductor chips are connected to one another by the at least one cladding layer;
• and
• a carrier comprising an assembly region on which the optoelectronic semiconductor chips are arranged and two mutually opposite side regions which are arranged transversely with respect to the assembly region,
• wherein the optoelectronic semiconductor chips are arranged at a distance from the assembly region, and
• wherein an interspace between the assembly region and the optoelectronic semiconductor chips is filled by the cladding layer.