Capacitor structures, decoupling structures and semiconductor devices including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Min LEE, Jongryul JUN, Eun A KIM, Jung-Bum LIM
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AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Min LEE, Jongryul JUN, Eun A KIM, Jung-Bum LIM
Estimating the term…
Decoupling structures are provided. The decoupling structures may include first conductive patterns, second conductive patterns and a unitary supporting structure that structurally supports the first conductive patterns and the second conductive patterns. The decoupling structures may also include a common electrode disposed between ones of the first conductive patterns and between ones of the second conductive patterns. The first conductive patterns and the common electrode are electrodes of a first capacitor, and the second conductive patterns and the common electrode are electrodes of a second capacitor. The unitary supporting structure may include openings when viewed from a plan perspective. The first conductive patterns and the second conductive patterns are horizontally spaced apart from each other with a separation region therebetween, and none of the openings extend into the separation region.
An integrated circuit device, comprising:
A decoupling structure, comprising:
Dependencies are inferred from the claim text.