Semiconductor Device and Method of Forming Substrate Including Embedded Component with Symmetrical Structure

A method of making a semiconductor device, comprising:

• forming a first insulating layer;
• disposing an electrical component over the first insulating layer;
• forming a second insulating layer over the electrical component;
• forming a first conductive via through the first insulating layer extending to a terminal of the electrical component;
• and
• forming a second conductive via through the second insulating layer extending to the terminal of the electrical component.

A method of making a semiconductor device, comprising:

• forming a substrate including an electrical component embedded in the substrate;
• forming a first conductive via through a first surface of the substrate to a terminal of the electrical component;
• and
• forming a second conductive via through a second surface of the substrate to the terminal of the electrical component.

A semiconductor device, comprising:

• a substrate including an electrical component embedded in the substrate;
• a first conductive via formed through a first surface of the substrate to a terminal of the electrical component;
• and
• a second conductive via formed through a second surface of the substrate to the terminal of the electrical component.