Semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorShou-Chian HSU
Life of this patent
Estimating the term…
Abstract
Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may form a cavity within the image sensor. The image sensor package may also include at least one electrical contact coupled to a second side of the image sensor chip opposing the first side and an encapsulant coating an entirety of the sidewalls of the image sensor package.
Claims12
An image sensor package comprising:
- an image sensor chip;
- a first layer comprising an opening therethrough coupled to a first side of the image sensor chip;
- an optically transmissive cover coupled to the first layer, wherein the optically transmissive cover, the first layer, and the image sensor chip comprise a cavity within the image sensor package;
- at least one electrical contact coupled to a second side of the image sensor chip opposing the first side;
- and
- an encapsulant coating an entirety of the sidewalls of the image sensor package;
- wherein a perimeter of the optically transmissive cover is the same size as a perimeter of the first side of the image sensor chip.
-20. (canceled)
An image sensor package comprising:
- an image sensor chip;
- a first layer comprising a plurality of dams coupled to a first side of the image sensor chip;
- an optically transmissive cover coupled to the plurality of dams, wherein the optically transmissive cover, the plurality of dams, and the image sensor chip comprise a cavity within the image sensor package;
- a redistribution layer covering the second side of the image sensor chip;
- at least one electrical contact coupled to a second side of the image sensor chip opposing the first side;
- and
- an encapsulant coating an entirety of the sidewalls of the image sensor package;
- wherein the encapsulant is a single encapsulant substantially covering five sides of the package.
(canceled)
Dependencies are inferred from the claim text.