Imaging device, manufacturing method, and electronic apparatus

A method of manufacturing an imaging device that includes:

• a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
• a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
• a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area;
• and
• a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
• wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area, the method comprising:
• forming the second adhesive member with a discontinuous part in the outer peripheral region of either the sensor substrate or the sealing member;
• forming the first adhesive member on an entire surface except an area in which the second adhesive member has been formed;
• and
• bonding the sensor substrate and the sealing member with the first adhesive member and the second adhesive member.

A method of manufacturing an imaging device that includes:

• a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
• a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
• a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area;
• and
• a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
• wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area, the method comprising:
• forming the second adhesive member, at a wafer level before the imaging device is divided into individual pieces, such that the second adhesive member is disposed in the outer peripheral region except portions at which chip edges of the imaging device are to be formed;
• forming the first adhesive member on an entire surface except an area in which the second adhesive member has been formed;
• bonding the sensor substrate and the sealing member with the first adhesive member and the second adhesive member;
• and
• performing dicing at the portions at which chip edges of the imaging device are to be formed.

An electronic apparatus comprising an imaging device that includes:

• a sensor substrate provided with an effective pixel area in which a plurality of pixels is arranged in an array;
• a transparent sealing member that seals a surface of the sensor substrate on the effective pixel area side;
• a first adhesive member that bonds the sensor substrate and the sealing member in an area including at least the effective pixel area;
• and
• a second adhesive member that bonds the sensor substrate and the sealing member in an outer peripheral region located outside the effective pixel area in a planar view, and has higher rigidity than the first adhesive member,
• wherein a product of adhesive strength per unit area of the first adhesive member and the second adhesive member in the outer peripheral region and an area of a part bonded in the outer peripheral region is set to be larger than a product of adhesive strength per unit area of the first adhesive member in the effective pixel area and an area of a part bonded in the effective pixel area.