Image sensor package and image sensing module
AssigneeSamsung Electronics Co., Ltd.
InventorYoung Bae KIM
Life of this patent
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Abstract
An image sensor package includes a substrate, an image sensor chip disposed on the substrate, and an external force absorbing layer disposed between the substrate and the image sensor chip and having a first surface and a second surface opposite to the first surface. The image sensor package further includes an adhesive layer configured to bond the second surface of the external force absorbing layer to the substrate. The adhesive layer has a first modulus, and the external force absorbing layer has a second modulus different from the first modulus.
Claims20
An image sensor package, comprising:
- a substrate;
- an image sensor chip disposed on the substrate;
- an external force absorbing layer disposed between the substrate and the image sensor chip and having a first surface and a second surface opposite to the first surface;
- and
- an adhesive layer configured to bond the second surface of the external force absorbing layer to the substrate,
- wherein the adhesive layer has a first modulus, and the external force absorbing layer has a second modulus different from the first modulus.
An image sensor package comprising:
- a substrate;
- an external force absorbing layer disposed on the substrate and having a first surface and a second surface opposite to the first surface, wherein the first surface faces the substrate;
- an adhesive layer interposed between the external force absorbing layer and the substrate to bond the first surface of the external force absorbing layer to the substrate;
- a molding portion disposed on the second surface of the external force absorbing layer and comprising a memory chip and a thermal die;
- and
- an image sensor chip electrically connected to the memory chip and disposed on the molding portion,
- wherein the adhesive layer has a first modulus, and the external force absorbing layer has a second modulus less than the first modulus.
An image sensing module comprising;
- a substrate having a first region, a second region surrounding the first region, and a third region surrounding the second region;
- an adhesive layer having a first surface and a second surface opposed to each other, wherein the first surface is bonded to the first region of the substrate;
- an external force absorbing layer bonded to the second surface of the adhesive layer;
- a molding layer disposed on the external force absorbing layer;
- an image sensor chip disposed on the molding layer;
- a lens spaced apart from and disposed above the image sensor chip;
- and
- a support member disposed in the third region of the substrate and supporting the lens,
- wherein the adhesive layer has a first modulus, and the external force absorbing layer has a second modulus less than the first modulus.
Dependencies are inferred from the claim text.