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US 2019/0172861 A1Published application
Semiconductor package and related methods
AssigneeSemiconductor Components Industries, LLC
InventorYu-Te HSIEH
Life of this patent
Estimating the term…
Abstract
Implementations of semiconductor packages may include: a substrate, a die electrically coupled to the substrate, and a wall coupled to the substrate wall. The wall may extend around a perimeter of the die. The wall may include a molding dam formed therein. The semiconductor package may also include a glass lid coupled to the wall and the molding dam. A mold compound may be coupled into the molding dam and across a thickness of the glass lid.
Claims24
A semiconductor package comprising:
- a substrate;
- a die electrically coupled to the substrate;
- a wall coupled to the substrate the wall extending around a perimeter of the die, the wall comprising a molding dam formed therein;
- a glass lid coupled to the wall and the molding dam;
- and
- a mold compound coupled into the molding dam and across a thickness of the glass lid.
3 more elements
A semiconductor package comprising:
- a substrate;
- one or more die electrically coupled to the substrate;
- a wall coupled to the substrate and a glass lid, the wall extending around a perimeter of the one or more die;
- a metal layer coupled across a thickness of the substrate, the wall, and a thickness of the glass lid;
- wherein the metal layer forms a substantially hermetic seal for the one or more die.
2 more elements
A method for forming a semiconductor package, the method comprising:
- providing a substrate sheet;
- coupling two or more walls to the substrate sheet, the two or more walls located around two or more die locations of the substrate sheet, the two or more walls comprising a molding dam therein;
- coupling two or more die to the substrate at the two or more die locations;
- coupling two or more glass lids to the two or more walls over the two or more die;
- applying mold compound into the molding dam of the two or more walls;
- and
- singulating two or more semiconductor packages at the molding dam;
- wherein the molding dam securely couples the two or more glass lids to the two or more walls.
5 more elements
Dependencies are inferred from the claim text.