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US 2019/0172821 A1Published application
In-package photonics integration and assembly architecture
AssigneeIntel Corporation
InventorMyung Jin Yim
Life of this patent
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Abstract
In one embodiment, a microelectronic package structure comprises a substrate comprising at least one waveguide, a first instrument integrated circuit coupled to the substrate, a photonic engine coupled to the substrate and comprising an integrated circuit body, a transmit die, and a receive die. The photonic engine is positioned adjacent the at least one waveguide such that optical signals may be exchanged between the at least one waveguide and the transmit die and the at least one waveguide and the receive die. Other embodiments may be described.
Claims5
A photonic engine, comprising:
- an integrated circuit body;
- a transmit die;
- and
- a receive die;
- wherein:
- the transmit die and the receive die are coupled to the photonic engine by a first plurality of bumps having a first height;
- and
- the one or more solder balls are coupled to the photonic engine by a second plurality of bumps having a second height, greater than the first height.
5 more elements
Dependencies are inferred from the claim text.