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US 2019/0172820 A1Published application
Data storage system using wafer-level packaging
AssigneeIntel Corporation
InventorsJohn G. MEYERS, Leo J. CRAFT
Life of this patent
Estimating the term…
Abstract
A data storage system is described that uses wafer-level packaging. In one embodiment an apparatus includes a silicon wafer, a plurality of memory cells formed directly on the wafer, an encapsulant formed over the memory cells, a plurality of wiring connections to connect the memory cells to an external interface, a memory controller, and an external interface.
Claims20
An apparatus comprising:
- a silicon wafer;
- a plurality of memory cells formed directly on the wafer;
- an encapsulant formed over the memory cells;
- a plurality of wiring connections to connect the memory cells to an external interface;
- a memory controller;
- and
- an external interface.
4 more elements
An apparatus comprising:
- a silicon wafer;
- a plurality of memory cells formed directly on the wafer;
- an encapsulant formed over the memory cells;
- a plurality of wiring connections to connect the memory cells to an external interface;
- a memory controller attached to the wafer and connected to the memory cells over the wiring connections;
- and
- an external interface.
4 more elements
A memory system comprising:
- an enclosure configured to mount in a rack, the enclosure having a front configured to receive airflow and a rear configured for cabling;
- a backplane board in the enclosure having a memory connector and an external interface, the backplane board having a first side proximate the front of the enclosure and a second opposite side having the external interface;
- a memory card comprising a silicon wafer, a plurality of memory cells formed directly on the wafer, an encapsulant formed over the memory cells, a plurality of wiring connections to connect the memory cells to an external interface, a memory controller, and an external interface coupled to the memory connector of the backplane board;
- and
- a cabling interface at the rear of the enclosure coupled to the external connector.
2 more elements
Dependencies are inferred from the claim text.