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US 2019/0172816 A1Published application
Semiconductor package including heat sink
AssigneeSamsung Electronics Co., Ltd.
InventorsTae-sung KIM, Cheol-woo LEE
Life of this patent
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Abstract
A semiconductor package including a package base substrate; at least one semiconductor chip on the package base substrate; a heat sink attached on the at least one semiconductor chip, the heat sink including a base and a plurality of protrusion patterns on a top of the base; and a molding covering a top of the package base substrate, a side surface of the at least one semiconductor chip, and a side surface of the heat sink without covering a top of the heat sink.
Claims20
A semiconductor package, comprising:
- a package base substrate;
- at least one semiconductor chip on the package base substrate;
- a heat sink attached on the at least one semiconductor chip, the heat sink including a base and a plurality of protrusion patterns on a top of the base;
- and
- a molding covering a top of the package base substrate, a side surface of the at least one semiconductor chip, and a side surface of the heat sink without covering a top of the heat sink,
- wherein:
- the molding includes a filler, and
- a diameter of particles of the filler is greater than an interval between adjacent protrusion patterns of the plurality of protrusion patterns.
5 more elements
(canceled)
A semiconductor package, comprising:
- a package base substrate;
- at least one semiconductor chip on the package base substrate;
- a heat sink attached on the at least one semiconductor chip, the heat sink including a base and a plurality of protrusion patterns on a top of the base;
- a heat sink attach film covering a bottom of the heat sink, the heat sink attach film being between the heat sink and the at least one semiconductor chip;
- a conductive heat dissipation terminal passing through the heat sink attach film to contact the heat sink;
- a molding covering a top of the package base substrate, a side surface of the at least one semiconductor chip, and a side surface of the heat sink;
- and
- an electromagnetic shield covering a side surface of the package base substrate, a side surface and a top of the molding, and a top of the heat sink,
- wherein the conductive heat dissipation terminal fills a through via hole having a bottom and that passes through the heat sink attach film and the molding to the top of the package base substrate or a top of the at least one semiconductor chip.
6 more elements
A semiconductor package, comprising:
- a package base substrate;
- a semiconductor chip on the package base substrate;
- a heat sink attached on the semiconductor chip, the heat sink including a base and a plurality of protrusion patterns on a top of the base;
- a heat sink attach film covering a bottom of the heat sink, the heat sink attach film being between the heat sink and the semiconductor chip;
- a bonding wire electrically connecting the semiconductor chip to the package base substrate, a portion of the bonding wire being buried in the heat sink attach film;
- a molding covering a top of the package base substrate, a side surface of the semiconductor chip, and a side surface of the heat sink;
- and
- an electromagnetic shield contacting a side surface of the package base substrate, a side surface and a top of the molding, and a top of the heat sink,
- wherein a thickness of the electromagnetic shield is greater than a vertical height of each of the plurality of protrusions of the heat sink.
6 more elements
Dependencies are inferred from the claim text.