Package-in-Package Structure for Semiconductor Devices and Methods of Manufacture

A method of manufacturing semiconductor packages, the method comprising:

• providing a plurality of first leadframe assemblies each of which includes a first die pad, a first plurality of leads, and a first semiconductor die attached to the first die pad and electrically connected to the first plurality of leads;
• stacking a plurality of second leadframe assemblies above each of the first leadframe assemblies, each second leadframe assembly comprising a second die pad, a second plurality of leads, and a second semiconductor die attached to the second die pad and electrically connected to the second plurality of leads;
• providing an electrically insulative spacer between the first leadframe assemblies and the second leadframe assemblies;
• embedding part of each first leadframe assembly, part of each second leadframe assembly and each electrically insulative spacer in a single mold compound, so that a portion of each first plurality of leads and a portion of each second plurality of leads are uncovered by the mold compound to form terminals of respective semiconductor packages, and so that a side of each first die pad facing away from the adjacent first semiconductor die and a side of each second die pad facing away from the adjacent second semiconductor die are uncovered by the mold compound;
• and
• singulating the respective semiconductor packages into individual packages.