Joined structure, joining method, and joining material
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorTAKAHIRO KUMAKAWA
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorTAKAHIRO KUMAKAWA
Estimating the term…
A joined structure includes: a first member; and a second member that faces the first member and that is joined to the first member via a joining layer. The joining layer includes a metal material and a solder material, apart of the metal material has at least one pore, and the solder material is located in a part of an internal area of the at least one pore. Also disclosed is a joining method that makes it possible to produce the joined structure. Further disclosed is a joining material used in the joining method. The joining method makes it possible to achieve non-pressurization sintering processes while maintaining high precise thickness of a joining layer between the first layer and the second layer based on the spacer.
A joined structure, comprising:
A joining method, comprising:
A nanometal paste joining material, comprising metal nanoparticles, a solvent, and a spacer that is melted or decomposed at a temperature lower than a boiling point of the solvent.
Dependencies are inferred from the claim text.