US 2019/0172800 A1 · SENSOR AND HEATER FOR STIMULUS-INITIATED FRACTURE OF A SUBSTRATE

Abstract

A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

Claims26

Dependent claims

A method of forming a photodiode comprising:

depositing a first electrode layer over a substrate;
depositing a first doped layer of an active region over the first electrode layer;
depositing an intrinsic layer over the first doped layer;
depositing a second doped layer of the active region over the intrinsic layer;
depositing a second electrode layer over the second doped layer;
and
patterning the first electrode layer, the first doped layer, the intrinsic layer, the second doped layer, and the second electrode layer to form the photodiode in not more than two mask steps.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/257,304Filed 25 Jan 2019

Priority

26 Jul 2016

Published

6 Jun 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification15 codes

H10W 42/405
Protecting against tampering, e.g. unauthorised inspection or reverse engineering: using active circuits
H03K 19/17768
Structural details of configuration resources: for security
H10F 71/103
The devices comprising amorphous semiconductor material: including only Group IV materials
H10W 20/493
Adaptable interconnections, e.g. fuses or antifuses: fuses, i.e. interconnections changeable from conductive to non-conductive

Sensor and heater for stimulus-initiated fracture of a substrate

Life of this patent

Sensor and heater for stimulus-initiated fracture of a substrate

Life of this patent

Abstract

Claims26