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US 2019/0172796 A1Published application
Method of manufacturing a semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsZi-Jheng LIU, Jo-Lin LAN, Yu-Hsiang HU, Hung-Jui KUO
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Abstract
A method includes forming an insulating film over a semiconductor structure, forming a sealing ring over a sidewall of the insulating film, and forming a protective layer over an exposed sidewall of the sealing ring. The semiconductor structure includes a semiconductor chip and a molding compound disposed around the semiconductor chip. The exposed sidewall of the sealing ring faces away from the sidewall of the insulating film.
Claims20
A method, comprising:
- forming an insulating film over a semiconductor structure, wherein the semiconductor structure comprises:
- a semiconductor chip;
- and
- a molding compound disposed around the semiconductor chip;
- forming a sealing ring over a sidewall of the insulating film, wherein a sidewall of the sealing ring facing away from the sidewall of the insulating film is exposed;
- and
- forming a protective layer over the exposed sidewall of the sealing ring.
4 more elements
A method, comprising:
- forming an insulating film over a semiconductor structure, wherein the semiconductor structure comprises:
- a semiconductor chip;
- and
- a molding compound disposed around the semiconductor chip;
- forming a sealing ring over a sidewall of the insulating film;
- and
- forming a protective layer over a sidewall of the sealing ring and in contact with a top surface of the semiconductor structure.
4 more elements
A method, comprising:
- forming an insulating film over a semiconductor structure, wherein the semiconductor structure comprises:
- a semiconductor chip;
- and
- a molding compound disposed around the semiconductor chip;
- forming a sealing ring, wherein the sealing ring has a first portion extending substantially along a top surface of the semiconductor structure, a second portion extending substantially along a sidewall of the insulating film, and a third portion extending substantially along a top surface of the insulating film;
- and
- forming a protective layer over the sealing ring.
4 more elements
Dependencies are inferred from the claim text.