US 2019/0172795 A1 · CRACK SENSOR FOR SENSING CRACKS IN A SOLDER PAD, AND METHOD FOR PRODUCTION QUALITY CONTROL

Abstract

An integrated circuit includes a solder pad which includes, in a superposition of metallization levels, an underlying structure formed by a network of first regular metal tracks that are arranged for reinforcing the mechanical strength of the underlying structure and electrically connecting between an upper metallization level and a lower metallization level of the underlying structure. The underlying structure further includes a detection electrical path formed by second metal tracks passing between the first metal tracks in the metallization levels, the detection electrical path having an input terminal and an output terminal. Electrical sensing of the detection electrical path is made to supply a measurement which is indicative of the presence of cracks in the underlying structure.

Claims14

Dependent claims

An integrated circuit, comprising:

at least one solder pad including, in a superposition of a plurality of metallization levels, an underlying structure comprising a network of first parallel metal tracks present in at least two metallization levels and which are arranged for reinforcing a mechanical strength of said underlying structure and for establishing an electrical connection between an upper metallization level and a lower metallization level of the underlying structure;
a detection electrical path within the underlying structure that includes, in said at least two metallization levels, second metal tracks insulated from and passing between the first parallel metal tracks, the detection electrical path having an input terminal and an output terminal configured to permit a measurement of a quality which is indicative of a presence of a crack in said underlying structure.

An integrated circuit, comprising:

a solder pad;
an underlying structure formed in a superposition of a plurality of metallization levels below the solder pad and electrically connected to the solder pad, said underlying structure comprising:
in a first metallization level of said plurality of metallization levels:
a first metal track and a second metal track which extend parallel to each other in a first direction;
and
a third metal track which extends parallel to and between the first and second metal tracks;
wherein a width of the third metal track is less than widths of the first and second metal tracks;
in a second metallization level of said plurality of metallization levels:
a fourth metal track and a fifth metal track which extend parallel to each other in a second direction perpendicular to the first direction;
and
a sixth metal track which extends parallel to and between the fourth and fifth metal tracks;
wherein a width of the sixth metal track is less than widths of the fourth and fifth metal tracks;
and
wherein the first, second, fourth and fifth electrical tracks are electrically connected to each other by vias extending between the first and second metallization levels;
and
wherein the third and sixth electrical tracks are electrically connected to each other by a via extending between the first and second metallization levels to form a part of a detection electrical path having an input terminal and an output terminal configured to permit a measurement of a quality which is indicative of a presence of a crack in said underlying structure.

13 more elements

Dependencies are inferred from the claim text.

Crack sensor for sensing cracks in a solder pad, and method for production quality control

Life of this patent

Crack sensor for sensing cracks in a solder pad, and method for production quality control

Life of this patent

Abstract

Claims14