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US 2019/0172788 A1Published application
Semiconductor module
AssigneeKabushiki Kaisha Toyota Jidoshokki
InventorsNaoki KATO, Shogo MORI, Harumitsu SATO, Hiroki WATANABE, Hiroshi YUGUCHI, Yuri OTOBE
Life of this patent
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Abstract
A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.
Claims6
1-6. (canceled)
A semiconductor module comprising:
- a substrate;
- a bare chip including a plurality of electrodes disposed on an upper surface thereof and an electrode disposed on a lower surface thereof, the electrode on the lower surface being mounted on the substrate;
- and
- a conductor including a first joining portion that is joined to a control signal electrode of the electrodes disposed on the upper surface of the bare chip, a second joining portion that is joined to a control signal pattern on the substrate, and a connecting portion that electrically connects the first joining portion and the second joining portion, wherein
- the connecting portion is provided with an insulating member,
- a plurality of signal electrodes that includes the control signal electrode is provided for the one bare chip,
- the conductor is a plurality of conductors that are disposed respectively on the plurality of the signal electrodes, and
- the connecting portions of the plurality of conductors are fixed by the single insulating member.
5 more elements
Dependencies are inferred from the claim text.