High-density chip-to-chip interconnection with silicon bridge

A system for high-density chip-to-chip interconnection, the system comprising:

• a plurality of circuit dies;
• a laminate package substrate layer adjacent but not embedded to the plurality of circuit dies;
• one or more spacers is disposed but not embedded between the laminate package substrate layer and one of the plurality of circuit dies;
• a conductive interposer comprising a silicon bridge interconnecting but not embedded, a predetermined region of at least one of the plurality of circuit dies to at least another one of the plurality of circuit dies;
• wherein an upper construct of the silicon bridge is attached but not embedded to a surface of the predetermined region of the plurality of dies;
• and
• wherein the silicon bridge is adjacent but not embedded to the one or more spacers;
• and
• a top layer of a printed circuit board (PCB) coupled but not embedded with a bottom layer of the laminate package substrate layer.