Packaging substrate for semiconductor devices, corresponding device and method

A method, comprising:

• growing first and second electrically conductive formations on a first surface of a sacrificial carrier layer, wherein said first electrically conductive formations correspond to locations of first lands, and wherein said second electrically conductive formations correspond to locations of seconds lands,
• depositing an insulating material on said first surface of said sacrificial carrier layer to penetrate into indented portions between said second electrically conductive formations and cover said second electrically conductive formations while leaving said first electrically conductive formations uncovered, and
• removing the sacrificial carrier layer to produce a substrate including said first and second lands insulated from each other by the insulating material and having exposed surfaces of the both the first and second lands at a top surface of the substrate and exposed surfaces of only the first lands at a second surface of the substrate opposite the first surface.