Fan-out semiconductor package

A fan-out semiconductor package comprising:

• a frame including a plurality of insulating layers, a plurality of wiring layers disposed on the plurality of insulating layers, and a plurality of connection via layers penetrating through the plurality of insulating layers and electrically connecting the plurality of wiring layers to each other, and having a recess portion;
• a semiconductor chip having an active surface, on which connection pads are disposed, and an inactive surface opposing the active surface, and disposed in the recess portion;
• an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion;
• and
• a connection member disposed on the frame and the active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the plurality of wiring layers of the frame and the connection pads of the semiconductor chip to each other,
• wherein the recess portion includes a plurality of walls having different inclined angles.