A semiconductor chip, comprising:
- a mounting surface comprising a plurality of first conductive contacts and at least one second conductive contact,
- wherein each of the first contacts in the plurality is arranged in a regularly spaced apart array such that centroids of immediately adjacent ones of the first contacts are separated from one another in a first direction by a first distance,
- wherein each of the first contacts in the plurality have an identical first lateral extent,
- wherein the at least one second conductive contact is at least partially within an area which has the first lateral extent and is separated from an immediately adjacent one of the first contacts in the first direction by the first distance, and
- wherein at least one of the following is true:
- the at least one second conductive contact has a second lateral extent that is less than the first lateral extent;
- or
- a centroid of the at least one second conductive contact is separated in the first direction from the centroid of the immediately adjacent one of the first contacts by a second distance that is different from the first distance.