Back to results
US 2019/0172776 A1Published application
Method Of Making A Wire Support Leadframe For A Semiconductor Device
AssigneeTexas Instruments Incorporated
InventorsYUH-HARNG CHIEN, CHIH-CHIEN HO, STEVEN SU
Life of this patent
Estimating the term…
Abstract
A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.
Claims8
An integrated circuit, comprising:
- a pair of die pads;
- a pair of dies secured to the pair of die pads, the pair of dies electrically connected by at least one wire having a middle portion;
- a support bracket extending between the die pads and having a surface for maintaining the middle portion of the at least one wire no lower than a height from the die pads during overmolding of the integrated circuit, the height preventing electrical arcing between the dies and the at least one wire;
- and
- electrically insulating material overmolded over the pair of die pads, the at least one wire, and the pair of dies.
2 more elements
Dependencies are inferred from the claim text.