Flexible substrate and electronic device
AssigneeCanon Components, Inc.
InventorAkihiro SAKATA
Life of this patent
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Abstract
A flexible substrate according to the present invention comprises a first resin layer, a first wiring layer that is arranged on the first resin layer, a second resin layer that is arranged on the first resin layer so as to cover the first wiring layer, and a second wiring layer that is arranged on the second resin layer, wherein the first wiring layer and the second wiring layer are connected to each other with a filled via, and the first wiring layer and the second resin layer are in direct contact with each other. By virtue of this feature, the reliability of a flexible substrate will be improved with a relatively simple configuration.
Claims20
A flexible substrate comprising:
- a first resin layer;
- a first wiring layer that is arranged on the first resin layer;
- a second resin layer that is arranged on the first resin layer so as to cover the first wiring layer;
- and
- a second wiring layer that is arranged on the second resin layer,
- wherein the first wiring layer and the second wiring layer are connected to each other with a filled via, and the first wiring layer and the second resin layer are in direct contact with each other.
A flexible substrate comprising:
- a first resin layer;
- a first wiring layer that is arranged on the first resin layer;
- a second resin layer that is arranged on the first resin layer so as to cover the first wiring layer;
- and
- a third wiring layer that is arranged under the first resin layer,
- wherein the first wiring layer and the third wiring layer are connected to each other with a filled via, and the first wiring layer and the second resin layer are in direct contact with each other.
Dependencies are inferred from the claim text.