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US 2019/0172774 A1Published application
Recessed lead leadframe packages
AssigneeSemiconductor Components Industries, LLC
InventorFrancois RICODEAU
Life of this patent
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Abstract
Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip
Claims20
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one of the plurality of leads comprises a thinned portion adjacent to the semiconductor chip and is an at least one thinned lead;
- and
- wherein the plurality of leads, except for the at least one thinned lead, mechanically couple to the semiconductor chip through a die bonding material.
1 more element
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one lead electrically couples with a high voltage connector of the semiconductor chip;
- and
- wherein the plurality of leads, except for the at least one lead, mechanically couple to the semiconductor chip through a die bonding material.
1 more element
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one of the plurality of leads comprises a thinned portion and is an at least one thinned lead.
Dependencies are inferred from the claim text.