Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsTakumi Honda, Koji Yamashita, Shinji Tahara, Hironobu Hyakutake
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AssigneeTokyo Electron Limited
InventorsTakumi Honda, Koji Yamashita, Shinji Tahara, Hironobu Hyakutake
Estimating the term…
Substrates can be suppressed from being separated from supporting grooves. A substrate processing apparatus includes a substrate holding unit and a processing tub. The substrate holding unit is configured to hold multiple substrates. The processing tub is configured to store a processing liquid therein. The substrate holding unit includes a supporting body, an elevating device and a restriction unit. The supporting body has multiple supporting grooves and is configured to support the multiple substrates with a vertically standing posture from below in the multiple supporting grooves, respectively. The elevating device is configured to move the supporting body between a standby position above the processing tub and a processing position within the processing tub. The restriction unit is configured to be moved up and down along with the supporting body by the elevating device and configured to restrict an upward movement of the substrates with respect to the supporting body.
A substrate processing apparatus, comprising:
A substrate processing method, comprising:
Dependencies are inferred from the claim text.