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US 2019/0172730 A1Published application
Systems for integrated decomposition and scanning of a semiconducting wafer
AssigneeElemental Scientific, Inc.
InventorsTyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee, Jae Min Kim, Stephen H. Sudyka
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Abstract
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
Claims20
A nozzle system for scanning a surface of a semiconducting wafer comprising:
- a nozzle including
- a nozzle body defining an inlet port in fluid communication with a first nozzle port, and defining a second nozzle port in fluid communication with an outlet port, the nozzle body configured to receive a fluid through the inlet port and direct the fluid through the first nozzle port to introduce the fluid to a surface of a semiconducting wafer, the nozzle body configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port, and
- a nozzle hood extending from the nozzle body adjacent the first nozzle port and the second nozzle port and defining a channel disposed between the first nozzle port and the second nozzle port, the nozzle hood configured to direct the fluid from the first nozzle port to the second nozzle port along the surface of the semiconducting wafer;
- and
- a nozzle housing including
- a housing body defining an interior portion and an aperture through which at least a portion of the nozzle can pass when transitioning between an extended position and a retracted position.
3 more elements
A nozzle for scanning a surface of a semiconducting wafer comprising:
- a nozzle body defining an inlet port in fluid communication with a first nozzle port, and defining a second nozzle port in fluid communication with an outlet port, the nozzle body configured to receive a fluid through the inlet port and direct the fluid through the first nozzle port to introduce the fluid to a surface of a semiconducting wafer, the nozzle body configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port;
- and
- a nozzle hood extending from the nozzle body adjacent the first nozzle port and the second nozzle port and defining a channel disposed at least partially between the first nozzle port and the second nozzle port, the nozzle hood configured to direct the fluid from the first nozzle port to the second nozzle port along the surface of the semiconducting wafer.
Dependencies are inferred from the claim text.