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AssigneeApplied Materials, Inc.
InventorsXinyu BAO, Chun YAN, Hua CHUNG, Schubert S. CHU
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Embodiments disclosed herein generally relate to apparatus and methods for controlling substrate outgassing such that hazardous gasses are eliminated from a surface of a substrate after a Si:As process has been performed on a substrate, and prior to additional processing. The apparatus includes a purge station including an enclosure, a gas supply coupled to the enclosure, an exhaust pump coupled to the enclosure, a first purge gas port formed in the enclosure, a first channel operatively connected to the gas supply at a first end and to the first purge gas port at a second end, a second purge gas port formed in the enclosure, and a second channel operatively connected to the second purge gas port at a third end and to the exhaust pump at a fourth end. The first channel includes a particle filter, a heater, and a flow controller. The second channel includes a dry scrubber.
A semiconductor processing system, comprising:
A semiconductor processing system, comprising:
A semiconductor processing method, comprising:
(canceled)
Dependencies are inferred from the claim text.